Product number |
Backing material |
Adhesive |
Thickness
mm |
Adhesion
N/10mm
(gf/25mm) |
Remarks |
| UV Deactivate |
| 636000 |
PO90μm |
UV reactive polymeric adhesive |
0.10 |
Before UV : 2.6(660)
After UV : 0.2(50) |
For wafer dicing |
| 636015 |
PO150μm |
UV reactive polymeric adhesive |
0.16 |
Before UV : 3.0(760)
After UV : 0.2(60) |
For package dicing |
| 636020 |
PO90μm |
UV reactive polymeric adhesive |
0.10 |
Before UV : 3.2(820)
After UV : 0.2(60) |
For wafer dicing
High adhesion type |
